Certificate Tacking
| The latest exemptible item summing-up for RoHS Instructions | ||||
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1 ． the mercury content of Compact fluorescent lamps should not exceed 5 mg / lights 2 ． mercury content of general purpose of the straight tube fluorescent may not exceed: -- Salt phosphate 10 mg -- Normal three phosphate 5 mg -- Long-term effectiveness three phosphate 8 mg 3 ． mercury content of special purpose of the straight tube fluorescent 4 ． This not specifically mentioned in the appendix of the other lights in mercury content 5 ． lead content of Cathode ray tubes, electronic components and Luminous glass tube 6 ． Steel alloy elements in the lead content of 0.35%, aluminum content of 0.4%, copper alloy of lead content of 4%; 7 ． -- High-temperature melting of lead solder (ie: Sn-Pb solder alloy of lead content over 85%); -- For servers, storage systems and the memory of lead solder (exemption granted to 2010); -- For switching, signaling and transmission, and telecommunications network management network infrastructure equipment in the lead-free solder; -- Electronic ceramic products in the lead (for example: high-voltage electronic devices); (Which in 2005/747 / EC made an amended) 8 ． According to modification about the limitation of specific hazardous substances and the use of pre-manufactured sales and the 76/769 / EEC Directive section 91/338 / EEC Directive which are prohibit the cadmium plating outside. (Which in 2005/747 / EC made an amended) 9 ． Hexavalent chromium as carbon steel cooling system preservatives in the Absorption refrigerators 10 ． In accordance with the procedures section in 7 (2), the European Commission should evaluate the application of the following: --Deca BDE -- mercury content of special purpose of the straight tube fluorescent -- The lead of Following used solder: Servers, storage, exchange and transmission used in the network infrastructure, telecommunications, network management equipment (set this directive seeks to exempt part of the specific cut-off time); -- Lamp. 11 ． The lead used in clockwise connexion system 12 ． The lead used in Thermal conductivity of the nail gun module and coat 13 ． The lead and cadmium used in optical glass and glass filter 14 ． The lead of Microprocessor-pin package and used by the Connexion containing 80-85% lead compound (containing more than two kinds of components) of solder 15.The lead used in Flip-chip packaging in the semiconductor chip carrier and reliable connection between the formation of solder 16 ． The lead used in Portland band linear incandescent lamp casing 17 ． The lead halide used in Professional copiers in the high-density discharge lamp as a light 18 ． The lead used in Professional uses discharge lamp phosphors as a catalys 19 ． The lead used in Small energy-saving [FS:PAGE]lamps in the amalgam with special ingredients 20 ． The lead oxide used in LCDs to connect in front of and behind the fluorescent lamp in glass |
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